Direct-to-Chip (D2C)

D2C cooling, also known as Direct Liquid Cooling (DLC), is an advanced liquid cooling technology used in data centers to manage the heat generated by high-performance IT servers. Traditional air cooling cannot effectively or efficiently cool the hottest CPU's, GPU's, and sometimes memory modules. This leads to reduced performance and higher operating costs.

D2C delivers a cooling liquid directly to the hottest server components through designed and tested cold plates. The intelligent heart of the system is the Coolant Distribution Unit (CDU). The cooling liquid flows from the CDU through a series of pipes, in rack manifolds and tubes to reach the cold plates. As the liquid passes through the cold plate, it removes the heat and this heated liquid travels back to the CDU. The final stage is to cool the heated liquid before it repeats it's journey again. Dependent on your facility, this is achieved through either a liquid to liquid or liquid to air heat exchanger's.

Rack Based CDU's

These units are designed for installation inside the server rack. Facility water connections are required to cool high density's up to 300kW of thermal load. Liquid to air units can handle smaller thermal loads up to 10kW.

Suitable for smaller deployments whilst highly scalable

Row Based CDU's/Sidecars

Designed to sit in row with your server racks, these units also have the potential to sit in your Grey space. Available with liquid to liquid or liquid to air heat exchangers, row CDU's can be integrated into new or legacy facilities.

Liquid to air units can cool around 45-240kW of thermal load. Liquid to liquid units offer higher efficiency and cooling capacity for their footprint at up to 2MW in a single unit. Cooling capacities are affected by facility parameters.

Cost effective for larger deployments and future capacity

Rack Manifolds

Rack manifolds come in different shapes and sizes with different connection methods. Fundamentally they are all the same. Installed on brackets at the rear of the rack, they feature quick disconnects to allow safe and mess free removal of servers.

Supplying your individual servers with a cool flow and hot return path

Cold Plates

Cold plates also come in many shapes and sizes to cool Processors, GPU's and Memory. Many designs are available and all designs aim to achieve the same goal of:

Conducting as much heat from the surface of the server component to the surface of the Cold Plate as possible
Convecting as much heat as possible from the solid material into the cooling liquid as it passes through

A two step heat transfer process

Design

When it comes liquid cooling, one size definitely doesn't fit all. Let us understand your challenges so we can design for now and your facilities future.